A patented advanced lamination process to package different types of PCBA with components such as BLE module or fingerprint sensor, or battery under perfectly contolled temperature or pressure into banking card size or any shape or design.

A patented advanced lamination process to package different types of PCBA with components such as BLE module or fingerprint sensor, or battery under perfectly contolled temperature or pressure into banking card size or any shape or design.

A patented advanced lamination process to package different types of PCBA with components such as BLE module or fingerprint sensor, or battery under perfectly contolled temperature or pressure into banking card size or any shape or design.