OEM/ODM Lamination Service for PCBA Package - Durable & Customizable Embedded Electronics Processing
A patented advanced lamination process to package different types of PCBA with components such as BLE module or fingerprint sensor, or battery under perfectly contolled temperature or pressure into banking card size or any shape or design.

Core Technologies:
• BLE 5.0+ Find My Tags 
• Ultra-Thin NFC Cards 
• Solar-Powered E-Ink Labels 
• Fingerprint-Embedded PCBA