






| Process characteristics | |
| Low temperature operation: | Avoid high temperature damage to chips and materials. |
| High precision: | Ensure accurate alignment and firm bonding between chips and substrates. |
| Environmental protection: | Reduce energy consumption and harmful emissions. |
| Flexibility: | Suitable for a variety of materials and design requirements. |
| Improve yield: | Reduce defective products in production. |
| Extend life: | Enhance the durability of smart cards. |
| Lightweight finished products: | Usually similar to traditional bank cards, thin and light and easy to carry |







| Process characteristics | |
| Low temperature operation: | Avoid high temperature damage to chips and materials. |
| High precision: | Ensure accurate alignment and firm bonding between chips and substrates. |
| Environmental protection: | Reduce energy consumption and harmful emissions. |
| Flexibility: | Suitable for a variety of materials and design requirements. |
| Improve yield: | Reduce defective products in production. |
| Extend life: | Enhance the durability of smart cards. |
| Lightweight finished products: | Usually similar to traditional bank cards, thin and light and easy to carry |