Main features and benefits:
✅ Ultra-thin and flexible - less than 2 mm thick
✅ Customizable integration - supports BLE, NFC, RFID, LED, sensors and embedded ICs (such as payment chips).
✅ Cost-effective production - no high temperature or high pressure curing required
✅ Zero mold cost - no expensive injection molds are required, no minimum order quantity (MOQ) requirements.
✅ Fast delivery - from design to mass production in just a few days, helping you seize market opportunities.
✅ Fully customized - support any shape, size or printing design to meet brand promotion or creative needs.
✅ Ultra Portable - Credit card size or custom size, easily fits in wallet/card holder.
| Process characteristics | |
| Low temperature operation: | Avoid high temperature damage to chips and materials. |
| High precision: | Ensure accurate alignment and firm bonding between chips and substrates. |
| Environmental protection: | Reduce energy consumption and harmful emissions. |
| Flexibility: | Suitable for a variety of materials and design requirements. |
| Improve yield: | Reduce defective products in production. |
| Extend life: | Enhance the durability of smart cards. |
| Lightweight finished products: | Usually similar to traditional bank cards, thin and light and easy to carry |
Main features and benefits:
✅ Ultra-thin and flexible - less than 2 mm thick
✅ Customizable integration - supports BLE, NFC, RFID, LED, sensors and embedded ICs (such as payment chips).
✅ Cost-effective production - no high temperature or high pressure curing required
✅ Zero mold cost - no expensive injection molds are required, no minimum order quantity (MOQ) requirements.
✅ Fast delivery - from design to mass production in just a few days, helping you seize market opportunities.
✅ Fully customized - support any shape, size or printing design to meet brand promotion or creative needs.
✅ Ultra Portable - Credit card size or custom size, easily fits in wallet/card holder.
| Process characteristics | |
| Low temperature operation: | Avoid high temperature damage to chips and materials. |
| High precision: | Ensure accurate alignment and firm bonding between chips and substrates. |
| Environmental protection: | Reduce energy consumption and harmful emissions. |
| Flexibility: | Suitable for a variety of materials and design requirements. |
| Improve yield: | Reduce defective products in production. |
| Extend life: | Enhance the durability of smart cards. |
| Lightweight finished products: | Usually similar to traditional bank cards, thin and light and easy to carry |
