OEM/ODM Apple Find My Air Card Tracker – Ultra-Thin, Wallet-Friendly Item Locator
| Process characteristics | |
| Low temperature operation: | Avoid high temperature damage to chips and materials. |
| High precision: | Ensure accurate alignment and firm bonding between chips and substrates. |
| Environmental protection: | Reduce energy consumption and harmful emissions. |
| Flexibility: | Suitable for a variety of materials and design requirements. |
| Improve yield: | Reduce defective products in production. |
| Extend life: | Enhance the durability of smart cards. |
| Lightweight finished products: | Usually similar to traditional bank cards, thin and light and easy to carry |
|
Cold-pressed packaged thin card. Cooperation mode: Mode 1: Customer-supplied F/PCBA ultra-thin card processing The customer provides a complete set of circuit boards and components, and our company is responsible for packaging into cards. Mode 2: Customer-supplied R&D design The customer provides the main components, BOM list and design principle, and our company is responsible for PCB design, other component procurement, PCB production, component patch welding, and finally packaging into cards. Mode 3: Customer-supplied personalized customization
The customer provides the design ideas, and all other processes are completed by our company. |
Applications:
Everyday Carry (EDC) Security – Track wallets, passports, or keys globally via Find My.
Travel & Anti-Loss – Prevent lost luggage or backpacks in airports/hotels.
Gifts & Premium Promotions – Branded corporate gifts with added utility.
Outdoor Adventures – Attach to gear (e.g., cameras, bikes) for recovery.
Enterprise Asset Management Solutions – Tool Tracking or Medical Equipment
OEM/ODM Lamination Service for PCBA Package- Durable & Customizable Embedded Electronics Processing
A patented advanced lamination process to package different types of PCBA with components such as BLE module or fingerprint sensor, or battery under perfectly contolled temperature or pressure into banking card size or any shape or design.
| Process characteristics | |
| Low temperature operation: | Avoid high temperature damage to chips and materials. |
| High precision: | Ensure accurate alignment and firm bonding between chips and substrates. |
| Environmental protection: | Reduce energy consumption and harmful emissions. |
| Flexibility: | Suitable for a variety of materials and design requirements. |
| Improve yield: | Reduce defective products in production. |
| Extend life: | Enhance the durability of smart cards. |
| Lightweight finished products: | Usually similar to traditional bank cards, thin and light and easy to carry |
|
Cold-pressed packaged thin card. Cooperation mode: Mode 1: Customer-supplied F/PCBA ultra-thin card processing The customer provides a complete set of circuit boards and components, and our company is responsible for packaging into cards. Mode 2: Customer-supplied R&D design The customer provides the main components, BOM list and design principle, and our company is responsible for PCB design, other component procurement, PCB production, component patch welding, and finally packaging into cards. Mode 3: Customer-supplied personalized customization
The customer provides the design ideas, and all other processes are completed by our company. |
Applications:
✅ Corporate Customization-Electronic employee badges, membership cards, smart access control cards
✅Consumer Electronics-Bluetooth trackers, BLE Beacon, Fingerprint Smart Card, Find My Air Card Tracker, Digital (Crypto) Hard Wallet, Smart Keychains, mini GPS locators and so on.
✅ Promotional Gifts-Custom-printed designs for low-cost, high-impact branded giveaways
Why Choose Us?
✅ End-to-End IoT Solutions – From RFID asset tracking to biometric smart cards
✅ Global Reach – Exports to 100+ countries (EU/US/Asia/LATAM) with CE/FCC/ROHS compliance
✅ Mass Production Expertise – OEM/ODM support for custom BLE/NFC/E-Ink projects
✅ R&D-Driven Innovation – 30+ patents and copyrights in contactless tech & iOT.
Core Technologies:
• BLE 5.0+ Find My Tags
• Ultra-Thin NFC Cards
• Solar-Powered E-Ink Labels
• Fingerprint-Embedded PCBA
